In-situ thermal characterization and reliability of liquid metal thermal interface materials (TIMs) using packaged thermal test chips

The primary challenge in advancing thermal management for integrated circuits is the thermal contact resistance between heat-dissipating components and heat sinks or spreaders, which is caused by surface imperfections and irregularities. Thermal interface materials (TIMs) are employed to bridge these gaps and enhance heat dissipation efficiency. Liquid metal TIMs, with their superior thermal conductivity and ability to conform to surface irregularities, offer a highly effective solution for improving heat transfer. However, over time and with repeated use, liquid metal TIMs can degrade or void formations occur. Therefore, ensuring the reliability of liquid metal thermal interface materials is crucial.
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