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/Thermo-mechanical investigation of the thermal interface materials in integrated circuit packages

Thermo-mechanical investigation of the thermal interface materials in integrated circuit packages

Leuven | Just now

Exploring the Impact of Thermal and Mechanical Coupling on the Thermal Management of IC Packages
The existing bottleneck to further development on thermal management of integrated circuits lies in the thermal contact resistance between heat dissipating devices and heat sinks or heat spreaders caused by the surface imperfections and non-uniformities. Thermal interface materials (TIM) are used to fill these gaps and increase heat dissipation efficiency. One of the surface non-uniformity is the warpage of the die surface caused by the coefficient of thermal expansion mismatch of the materials during soldering and/or curing process. When there is a large warpage on the surface of the die, the TIM coverage can be altered based on the warpage height, TIM thickness and compressibility, which causes reduction in the heat transfer area and might lead to failure.

In this internship or thesis, you will:

•Use Finite Element modelling tools to investigate the thermal performance of integrated circuit packages.
•Run coupled thermal and mechanical analysis to explore the effect of warpage and TIM mechanical properties on the thermal performance of TIMs on the integrated circuit packages.
•Conduct experiments with state-of-the-art imec thermal test vehicles to measure the thermal performance of different thermal interface materials.
•Generate a guideline for selecting proper thermal interface materials based on the correlation between the mechanical and thermal properties and chip topology conditions.

Joining imec for this internship means becoming part of a top-tier research institute in nanoelectronics. At imec, we cultivate a collaborative environment that emphasizes innovation and continuous learning. You'll be part of a diverse, global team of experts, making contributions that have tangible real-world effects. Imec is dedicated to supporting your professional and personal growth, equipping you for a future at the forefront of technology.

Excel in your internship or Master's thesis at imec, and you could seamlessly transition into a PhD research role with us.


Type of project: Thesis, Internship, Combination of internship and thesis

Duration: 6-9 Months

Required degree: Master of Engineering Technology, Master of Science, Master of Engineering Science

Required background: Mechanical Engineering, Materials Engineering, Electromechanical engineering

Supervising scientist(s): For further information or for application, please contact: Onur Yenigun (Onur.Yenigun@imec.be)

Imec allowance will be provided for students studying at a non-Belgian university.

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