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/Comparative study of thermal simulation methods for advanced packaging in automotive applications

Comparative study of thermal simulation methods for advanced packaging in automotive applications

Leuven | Just now

Thermal management for the cars of the future

More compute power will be needed and integrated in the cars of the future for autonomy ranges from level 3 onwards. This brings additional requirements to the power and thermal performance of the chips, packaging and system integration.

The purpose of this work is to perform and compare different temperature analyses and modelling methods and combine with experimental validation.



Type of project: Combination of internship and thesis

Duration: 6 months

Required degree: Master of Engineering Science, Master of Science

Required background: Materials Engineering, Nanoscience & Nanotechnology, Mechanical Engineering, Physics

Supervising scientist(s): For further information or for application, please contact: Bart Vandevelde (Bart.Vandevelde@imec.be)

Imec allowance will be provided for students studying at a non-Belgian university.

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