Research & development - Leuven | About a week ago
Future generation memory devices are moving to complex 3D integration schemes to boost performance and to keep up with density scaling trends. That sets unprecedented challenges for novel material and thin film process development. Atomically controlled deposition processes in complex 3D structures require highly conformal depositions of multi-compound materials with homogeneous properties in vertical and lateral cavities, low thermal budget processes, and processes with precise interface control and uniformity for both dielectric and metallic films. In this context, the Thin Films for Functional Materials (TFFM) group within the Materials-Interfaces-Deposition-Analysis (MIDA) department at imec is looking for an R&D team lead with a strong technical background in deposition and integration in memory device technology to guide a group of talented engineers and researchers working on thin film development for future memory applications.
You will be leading an R&D team (5-10 people) within the MIDA department. The MIDA department is responsible for the research and development of novel thin films and thin film processes in imec’s 300 mm pilot line using state-of-the-art deposition and characterization equipment. Your team works application and project oriented and covers a broad variety of deposition techniques such as Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) for memory applications. You are expected to facilitate the team’s activities and allocate resources to support projects in imec’s research programs and bilaterals. You will need to define priorities, set individual and team objectives and goals, and follow-up on technical challenges and solutions for the applications that your team is covering. As a team lead, you will have the opportunity to actively participate in the development, as well as to drive the team’s long-term technical strategy. As such, technical knowledge in deposition of thin films and their integration is key. As an R&D team lead in thin films, you will have close interactions with different expertise groups and departments to come up with thin film solutions. You will build a close relationship with not only internal, but also external customers, in particular equipment and material suppliers, to stay up to date with novel advances in deposition technology and to do an assessment of their potential for imec’s advanced device fabrication.
We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.
We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.
We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.
IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.