2D Material Transfer Process Engineer

What you will do

Heterogeneous integration refers to the process of combining different types of components, materials, or even technologies into a single system or package to achieve enhanced functionality or performance. An emerging example of such a heterogeneous process step is the transfer of a 2D material like a transition metal dichalcogenide (i.e., MX2) to facilitate future logic, memory, sensor or even optical devices. The main advantage of such a transfer approach is that the device wafer is not exposed to the harsh synthesis conditions of a 2D material (e.g. high thermal budget and incompatible chemical environments). As a result, the heterogeneous 2D transfer approach makes that the optimal 2D material quality can be targeted. 

A 300mm 2D material transfer flow has been demonstrated at imec using a temporary rigid carrier system, but this 2D transfer concept needs to be further optimized to enable a stable high-quality 2D material transfer flow for future technology nodes. To reach a high yield 2D transfer process, a simplified wafer scale epitaxial MX2 transfer flow needs to be developed while ensuring controlled 2D interfaces.  

As a member of the MAterial Transfer (MAT) team, you will be responsible for executing and optimizing 2D material transfer processing at imec’s 200 or 300mm pilot line. You will have to analyse metrology data, deduce transfer yield values and implement transfer optimizations in the FAB. You will have to evaluate bonding, peeling and new carrier release processes focused on wafer-scale metal dichalcogenide transfer development. As a process engineer you will work closely together with other researchers (e.g. researchers involved in 2D material transfer concepts in the LAB, in 2D growth, in 2D integration or in 2D metrology) to push newly developed processes to a higher FAB maturity level and, in the end, release these processes to the imec pilot line.  

As an 2D material transfer process engineer you will have a significant number of responsibilities and will therefore be highly influential in helping to achieve the team’s goals and targets.  
As a process engineer: 

• You will be responsible for the process step developments and the stability of 2D material temporary bonding, peeling, permanent bonding and carrier release steps in the FAB. 
• You will construct DoE’s and summarise results focused on 2D material transfer optimizations. You will report progress, results, and opportunities to various organizational levels both internally as well as to customers, suppliers and partners. 
• You will be expected to take a significant hands-on role within the cleanroom. You will share ownership of the 2D material transfer process with your direct colleagues, and you will have to improve the maturity level of this 2D transfer process. 
• You will report process improvements to the involved 2D transfer team and also discuss these results over team boundaries. Being a team player is essential for this type of work. 
• You will have to make the link with the engineering department making sure to safeguard the deliverables of both FAB and research departments. 

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth. 

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits. 

Who you are

• You have a Master’s degree in Physics, Chemistry, Industrial or Materials Science. 
• You have extensive experience with 2D material processing. You have a working knowledge of 2D transfer. In best case, you even have a basic understanding of other semiconductor manufacturing areas (e.g., lithography, etch, CMP, etc.).  
• You are highly motivated and self-driven and will initiate and assume ownership of problem solving and process improvement activities. 
• You are innovative and creative in finding solutions to problems. 
• You are comfortable working in a team environment, but at the same time you can also work autonomously with minimal supervision when required. 
• You are passionate about application development, data interpretation and are focused on achieving high quality results. 
• You are highly organized and have a logical and methodical working style. 
• You are eager to work in a highly competitive and multicultural environment. To allow you to function in this setting, you must be fluent in both written and spoken English.  
• Experience with wafer level bonding production tools is considered a plus.  

IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.