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Imec Pushes the Limits of EUVL Single Exposure for Logic N5 Metal Layers and Dense DRAM Applications

Imec presents initial electrical results on N5 32nm pitch metal-2 layer

Reading room

Article GaN

Longread

DC Reliability of high-κ GaN-on-Si MOS-HEMTs for mm-Wave Power Amplifiers
PR ASML

Press

ASML and imec sign strategic partnership agreement
Article DRAM peri

Featured in the media

A technology platform for thermally stable DRAM peripheral transistors
PR e-testing

Press

Electrical yield for 20nm pitch metal lines obtained with High NA EUV single patterning
Article Wi-fi on steroids

Research update

‘Wi-Fi on steroids’ allows manufacturing industry to cut the cord
Luc Van den hove

Vision

Be visionary, aim high, dare to make bold decisions
Article 2D-material

Page-turner

Introducing 2D-material based devices in the logic scaling roadmap
Article NREE Buffer Memory

Research update

A novel 3D buffer memory for AI and machine learning
Vertical compute

Press

Vertical Compute raises € 20 million to revolutionize AI Computing
PR Nano-ridge laser

Press

Full-wafer fabrication of electrically-pumped GaAs-based nano-ridge lasers on 300mm silicon wafers
PR perovskite

Press

Imec and partners show outdoor stability of perovskite solar modules
Network on chip

Longread

Tackling network-on-chip (NoC) scaling challenges with an STCO approach

Published on:

23 February 2018

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