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Imec Demonstrates Power-Performance-Area-Cost Benefit of Heterogeneous Sequential-3D Integration for Advanced CMOS Nodes

Reading room

Article Luc

Blog

"A grain of sand, a world of hope"
Portrait of Francesca Lacopi

Testimonial

Meet imec fellow Francesca Iacopi
2024

Listicle

Imec in 2024
Article 140 GHz radar

Blog

High resolution, low cost: 140 GHz radar is bringing smarter, safer cars within everyone’s reach
PR Lead-free quantum dots

Press

SWIR sensor with lead-free quantum dot photodiodes
Article SOT-MRAM

Research update

Bringing SOT-MRAM technology closer to last-level cache memory specifications
PR 3D Buffer memory

Press

3D charge-coupled device with IGZO channel as buffer memory for data-intensive compute applications
PR Superconducting logic

Press

Core building blocks of scalable superconducting digital technology
PR InP Chiplet integration

Press

Seamless InP chiplet integration on 300mm RF Silicon interposer
PR double row CFET

Press

Imec proposes double-row CFET for the A7 technology node
Article Interfacing Sipho

Featured in the media

Interfacing silicon photonics for high-density co-packaged optics
Earth observation spectral imaging
More efficient Earth observation thanks to on-chip spectral imaging

Published on:

4 December 2017

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