Thermal Integrity Analysis on 2.5D Heterogeneous packaging solutions

Introduction & context

The semiconductor industry is increasingly moving toward 2.5D heterogeneous packaging solutions in response to the growing demand for higher performance, greater functionality, and reduced form factors in modern electronic devices. Traditional monolithic integration faces limitations in terms of scalability, power dissipation, and interconnect density, particularly as device sizes and functionality continue to increase. 2.5D heterogeneous packaging enables the integration of multiple different semiconductor devices, such as logic, memory, and analog components, onto a single package using a shared interposer. This approach allows for high-bandwidth communication between chips, improved signal integrity, and reduced power consumption, all while maintaining compactness and minimizing footprint. The ability to integrate diverse technologies in a single package is becoming a strategic advantage, providing higher performance and flexibility.

However, the increasing complexity and density of these packages introduce significant challenges in thermal management, as the compact arrangement of multiple components on a shared substrate leads to concentrated heat sources and more complex pathways for heat dissipation. Without proper thermal regulation, excessive temperatures can cause thermal stress, interconnect failures, or even complete device malfunction, thus compromising the reliability and lifespan of the entire system. Given these concerns, accurately understanding and predicting thermal behavior is crucial for optimizing design choices and mitigating thermal risks. Therefore thermal modeling and simulations have become indispensable tools for analyzing heat distribution, thermal gradients, and the effects of various packaging configurations. 

Thesis focus

This thesis focusses on developing thermal models and performing simulations on such packaging structures. to provide a comprehensive analysis of the thermal performance of a 2.5D heterogeneous package solution, aiming to enhance both its reliability and efficiency for next-generation electronic applications.

Candidate profile

We are looking for a student that is highly motivated with an inquisitive attitude. To ensure optimal collaboration the candidate should be fluent in English.