Support Engineer

Ghent University – imec IDLab Design group

Ghent University is one of the most important education and research institutions in the Low Countries, ranked 90 in the Academic Ranking of World Universities. On a daily basis, over 15,000 staff members and 50,000 students implement its motto "Dare to Think". Ghent University's mission statement is characterized by qualitative education, internationally renowned research and a pluralistic social responsibility.

The IDLab research group is also a core group of imec. Imec is the world-leading research and innovation hub in nanoelectronics and digital technologies. Imec is headquartered in Leuven, Belgium and also has distributed R&D groups at a number of Flemish universities, in the Netherlands, Taiwan, USA, China, and offices in India and Japan.

All of these particular traits make IDLab a top-class research employer.

Context

The IDLab-Design group, of Ghent University and imec is conducting world-leading research towards new complex opto-electronic sub-systems and systems, typically relying on electronic and photonic integrated circuits (chips) designed by the team. The applications for those chips cover ultra high-speed fiber-optic transceivers for data center networks (a critical part of the recent AI revolution), fiber-to-the-home networks, radio-over-fiber systems and optical communication for satellites. Recently, opto-electronics are also developed for applications operating in the quantum realm, focusing for example on true random number generators and quantum key distribution systems.

The fabricated chips need to be assembled onto custom-design testboards and substrates. The design of such boards is a critical task and needs to be executed carefully and in close collaboration with the team. After fabrication (which in some cases may be done internally using a state-of-the-art milling and CNC machine) various techniques are used to assemble the chips and other devices onto the board, such as wirebonding, flip-chip integration, optical fiber attachment, and various solder techniques. Specialized assembly equipment such as wirebonding, flip-chip tools etc. are available to be used on-site. Another critical assembly aspect is assembly of optical fibers with the photonic chips, for which recently also precision equipment was installed.

The assembled boards then need to be tested using an extensive suite of high-speed measurement equipment such as vector network analyzers (with probe station), high-speed sampling oscilloscopes or spectrum analyzers. This may involve not only electrical but also optical tests and measurement equipment. For complex cases, the measurements may involve semi-automatic collection of data points and traces with a multitude of instruments.

What you will do

Reporting to our lab manager, your tasks will be the following:
•    Take responsibility for and execute the design of high-speed circuit boards and substrates mounting designed and fabricated chips in close collaboration with the chip design team members.
•    Fabricate testboards using an available milling and CNC tool.
•    Take care of the assembly of the testboards and demonstrators, involving delicate steps such as wirebonding and flip-chip methods using available state-of-the-art equipment, including fiber attachment steps.
•    Assist with preparation of complex measurement setups for both internal team members and external customers, guide the use of expensive and fragile high-frequency measurement equipment.
•    Maintain and extend IDLab-Design’s script-based measurement equipment environment.

Who you are

•    You hold a Master of Science degree in Electronics Engineering Technology (ing.) or Electrical Engineering (ir.).
•    Experience with the design of printed circuit boards and electronic systems.

Interested?

Send your application (motivation letter and resume) or any questions concerning this vacancy to Peter Ossieur - Peter.ossieur@imec.be