Brussel | Just now
In optical metrology, conventional EUV/Hard X-ray microscopes face challenges in achieving high-NA objective lenses due to their non-conventional optical properties. As semiconductor patterns continue to shrink, there is an increasing demand to improve spatial and z-resolution, throughput, and field-of-view to meet industrial requirements.
We utilize the extended spectrum of soft X-rays for next-generation metrology and lithography applications. In the conventional EUV/Hard X-ray range, integrating high-NA objective lenses into microscopes is challenging due to the limitations of non-conventional optics. However, the soft X-ray region offers a viable alternative for inspecting materials that cannot be effectively analyzed using conventional approaches.
Responsibilities:
Type of project: Thesis, Internship, Combination of internship and thesis
Required degree: Master of Engineering Technology, Master of Science, Master of Engineering Science, Master of Bioengineering
Supervising scientist(s): For further information or for application, please contact: Hyun-su Kim (Hyun-su.Kim@imec.be)
Only for self-supporting students.