Compact, dynamic thermal modeling of Si photonic devices

The simulation of Si photonic modulators typically requires a multi-physics approach. These devices interact with light (FDTD simulation), electric signals (Ohmic/drift-diffusion simulation) and local changes in temperature and/or mechanical stress (finite element simulation). Hence, it is difficult to account for all physical effects simultaneously. In order to have an accurate behavioural model for the purpose of circuit simulation, a compact representation of the device is needed. Compact in this context means that instead of computing the full 3D field property (e.g. temperature or electric field), a single value is computed that is representative for the state of the device.

The objective of this research topic is to develop dynamic, electro-thermo-optic compact models of a Si photonic ring modulator or a Si photonic electro-absorption modulator (depending on the state of research at the start of the internship). Typical steps are:

• Literature search for device designs, key parameters, physical effects
• Develop compact SPICE models for different physical domains
• Validate these sub-domain models with high-fidelity simulation results
• Develop coupling strategy to solve non-linear, coupled sub-domain models

The projected outcome is to have a validated, multi-physics device compact model. This model will be used to study operational limits and possible design improvements.

Required skills:

• Programming: Python
• Simulation: Finite element method, SPICE electrical

Language requirements: English 

Type of Project: Internship 

Manager: Mario Gonzalez

Mentor: David Coenen 

For more information or application, please contact Mario Gonzalez (mario.gonzalez@imec.be) and David Coenen (david.coenen@imec.be).