Sparking New Industries
Imec will be participating in European Connected and Autonomous Vehicle Alliance (ECAVA), the first major public milestone since the Alliance's launch in October 2025 and the inaugural working group meetings in February 2026. Its main purpose is to bridge the gap between technical collaboration and political commitment – transforming the detailed work of engineers, project managers, and researchers into actionable strategic direction endorsed by industry leaders, ministers and the Commission. The event will gather political leadership, industry executives, city leaders and international partners. Join us to learn more on our latest breakthroughs and how to work with imec
The Neurotech Leaders Forum is a two-day event bringing together leaders from the neurotechnology and neuromodulation industries. Hosted at imec, the European edition of the forum, organized by Neurotech Reports, will feature keynotes, panels, and discussions on the latest advancements in the field.
From Integrated Devices to Integrated Chiplets: Design, Device and System Innovation for the Future.
The Hybrid and Perovskite materials for energy, lighting, sensing and computing conference (HYPE26) will gather researchers and innovators working on advanced materials and devices for next‑generation optoelectronic, energy, and intelligent technologies, with a strong emphasis on halide perovskites and hybrid material platforms. It will focus on how the unique physical properties of halide perovskites, their low‑dimensional derivatives, and perovskite‑based hybrids can be exploited in functional devices.
This year marks the 84th anniversary of the Device Research Conference (DRC)—the longest running device research meeting in the world. DRC will bring together leading scientists, researchers and students from varied disciplines in academia and industry to share their latest research and discoveries in the field. The high-caliber technical sessions are highlighted by plenary talks and invited talks by international research pioneers and leaders behind modern electronic technology.
From Cells to Patients
Enabling next-gen heterogeneous systems integration
Navigating Communication and Packaging Challenges in the AI Era

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