Past events

Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection.

The Most Powerful Tech Event in the World

International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades.

The 14th Korea-Japan workshop on Digital Holography and Information Photonics

Pioneering the future of semiconductor innovation

Exploring the future of automotive sensing. 

This webinar is dedicated to the production of NIL-Master. Our expert Dr. Matt Traub from imec will take us along and present various options of this technology. Nanoimprint lithography provides a connection between the expensive precision of CMOS and the manufacturing of lower cost devices. The production of NIL masters using deep ultra-violet photolithography allows high-resolution, high-density layouts to be achieved over large areas and replicated with great materials flexibility. This presentation will cover several example cases, including pattern transfer of extremely dense nanohole networks in low-index material, pattern transfer of optical gratings to a high-index dielectric, and fabrication of multi-step optical elements in functional resist.
 

The SISC provides a unique forum for device engineers, solid-state physicists, and materials scientists to discuss issues of common interest. Principal topics for discussion at SISC are semiconductor/insulator interfaces, the physics of insulating thin films, and the interaction among materials science, device physics, and state-of-the-art technology.