Bridging innovation, shaping the next chapter of chip collaboration
Chips for Europe
The International Conference on Atomic Layer Processing of Hybrid Materials 2026 (H-ALP26) brings together the global community working at the intersection of atomic layer deposition (ALD), molecular layer deposition (MLD), and advanced infiltration techniques such as vapor phase infiltration (VPI), atomic layer infiltration (ALI), or sequential infiltration synthesis (SIS). Building on the momentum of previous Hybrid ALP and VPI/MLD-focused meetings, the 2026 conference will highlight the rapid advancements, emerging applications, and scientific breakthroughs reshaping this dynamic field.
JASIS gathers analytical and scientific instrument manufacturers under one roof, thereby combining cutting-edge scientific and analytical systems and solutions.
This event explores how frontier technologies emerging from global startups can connect with Taiwan's world-class manufacturing and supply chain to accelerate validation, commercialization, and scale.
Scaling innovations to impact
Transform tomorrow
Powering prosperity
Shaping the future of Microelectronics & Robotics

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