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Imec, Inpria and TEL demonstrate integrated fab process for metal-oxide EUV photoresist
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Silicon photonics technology for next-generation datacenter interconnects
How to efficiently cool power electronics and optoelectronic sensors?
Make smartphones and autonomous vehicles see the impossible
Solving the contact resistance challenge for 7nm and beyond CMOS
Sensor searches demanding application
A cold shower for chips
A 300mm platform for 2D-material based MOSFET devices
Iuliana Radu on quantum computers
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Imec improves performance and understanding of stacked nanowire Gate-All-Around transistors for N3 and beyond
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Imec and partners report major breakthroughs for spintronic logic devices in two different implementations
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Imec demonstrates the feasibility of introducing SST-MRAM as a last-level cache at the 5nm technology node
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Imec first to stack FinFETS with 45nm fin pitch using sequential 3D integration
Published on:
22 February 2016
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