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Imec and Cascade Microtech Develop First Automatic Probe System for Advanced 3D Chips

Unique Award-Winning Test System Enables Pre-Bond Probing of 3D Chips with Large-Array Fine-Pitch Micro-Bumps

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Silicon photonics technology for next-generation datacenter interconnects
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How to efficiently cool power electronics and optoelectronic sensors?
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Make smartphones and autonomous vehicles see the impossible
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Solving the contact resistance challenge for 7nm and beyond CMOS
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A cold shower for chips
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Sensor searches demanding application
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A 300mm platform for 2D-material based MOSFET devices
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Iuliana Radu on quantum computers
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Press

Imec and partners report major breakthroughs for spintronic logic devices in two different implementations
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Press

Imec demonstrates the feasibility of introducing SST-MRAM as a last-level cache at the 5nm technology node
Cleanroom

Press

Imec first to stack FinFETS with 45nm fin pitch using sequential 3D integration
Man in white suit working in imec cleanroom

Press

Imec improves performance and understanding of stacked nanowire Gate-All-Around transistors for N3 and beyond

Published on:

24 May 2017

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