massLIFT

High demand, shrinking chip size, inefficient manufacture

The placement speed of conventional manufacturing techniques is too slow for cost-effective assembly of large quantities of small chips. Moreover it is impossible to mechanically handle small-size and ultra-thin chips and a reliable electrical contacting of the chips must be guaranteed.

Applying a new chip-printing technique

The massLIFT consortium consists of partners with expertise in electronics manufacturing, laser micro-machining and microelectronics soldering. Using research outcomes of IMEC-CMST, they will work together to develop a laser-induced forward-transfer (LIFT) approach to printing small chips. This approach results in a faster manufacturing process and lower costs.

Innovating robust, rapid assembly

The massLIFT consortium will create an effective placement process for very small semiconductor chips using ultra-fast laser pulses. The project will also aim to make this process compatible with all other processes in a robust chip assembly flow. The resulting solution targets high assembly speed with small placement error. The consortium will also identify quality assurance solutions and pave the way to further innovation.

Fostering trust, reducing dependency on outside parties

In addition to an effective solution, the project will advance LIFT technology for high-speed chip assembly and grow soldering materials knowledge. What’s more, it will lead to valuable insights into the evolutions needed to bring LIFT-assembled products to the market.

“The massLIFT consortium aims to develop a novel high-speed laser transfer printing process for small semiconductor chips, leading to new and more cost-effective applications of the technology in various domains.”