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Virtual Wall

The Virtual Wall at IDLab, an imec research group embedded in Ghent University and the University of Antwerp,&nbsp;is a large-scale generic environment for advanced networking, distributed software, cloud, big data and scalability research and testing.

<a href="http://idlab.technology/infrastructure/virtual-wall">Click here</a> for more info.

Some examples of what we have done

Julien Ryckaert

A new approach to miniaturization with greater versatility for compute system optimization

Vision

Julien Ryckaert, VP Logic Technologies at imec, explains how CMOS 2.0 brings heterogeneity inside the compute system-on-chip (SoC), as such addressing a broader variety of compute specificities.

He identifies advanced 3D interconnect and backside technologies as instrumental to realize this concept...

... and calls upon the semiconductor ecosystem to adapt to this new way of approaching miniaturization.

CMOS 2.0: bringing heterogeneity inside the system-on-chip

Inside imec's N2 P-PDK workshop

Anita Farokhnejad

Sara Louahdi

Hands-on training grants academia and industry access to cutting-edge semiconductor technologies.

Blog

Imec’s N2 P-PDK workshop explores advanced semiconductor design strategies.

Participants from industry and academia gain hands-on N2 design experience, using tools from Synopsis and Cadence.

Imec’s initiative supports global semiconductor innovation and is closely tied to the European Chips Act objectives.

Unlocking tomorrow's technology nodes: inside imec's N2 P-PDK workshop

Leap in Belgian quantum communication infrastructure: first QKD links  

Jade Liu

New leap in Belgian quantum communication infrastructure: imec, UGent and Belnet realize first QKD links  

Carolina Mora Lopez

New research into higher-density neural probes, more extensive electrode coverage of the brain surface, and electrical stimulation ability.

This article highlights recent advancements in neurotechnology, presented in three papers at the 2024 VLSI Circuits Symposium.

A new high-density readout IC for multiplexed channels allows for large-scale recordings of brain-surface activity.

Imec’s latest neural probe for deep-brain recordings features a record-high channel count and improved performance compared to the state of the art.

A novel technique to suppress stimulation artifacts in brain recordings holds promise for combined stimulation/recording implants.

Advancing neurotech from brain surface to brain depths 

Imec introduces best-in-class ADCs for base stations and smartphones

Imec introduces best-in-class ADCs for base stations and smartphones, propelling beyond-5G communications

Imec demonstrates functional monolithic CFET devices with stacked bottom and top contacts

Joris Van Campenhout

"At imec, you find yourself in a unique situation. Make true use of it."

Testimonial

<ul>
	<li>Joined imec in 2010</li>
	<li>Photonics engineer, program manager optical I/O, chief technologist silicon photonics, program director optical I/O</li>
	<li>Became imec fellow in 2020&nbsp;</li>
</ul>

Meet imec fellow Joris Van Campenhout

Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter

Designed to support next-generation, short-range, high-speed wireless services at frequencies above 100GHz – from wireless fail-safes in data centers to extended reality (XR) solutions

Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter, featuring superior output power and energy efficiency

How imec is advancing start-up innovation with Imec.DeepTechVentures

Featured in the media

Podcast: Deep-Tech disruption

Gouri Sankar Kar

The discovery of a memory effect in ovonic threshold switching (OTS) devices paves the way to a new compute express link (CXL) memory

Longread

While investigating ovonic threshold switching (OTS) devices for selector applications, researchers at imec observed an interesting phenomenon: the device can operate as a memory itself.

This OTS-only memory involves a simple and cost-effective fabrication process, is scalable to larger densities, and shows promising performance characteristics for compute express link (CXL) memory-like applications – in between DRAM and NAND.

In this article, you learn how the OTS-only memory evolved out of OTS selector device technology, how it works, and which research directions are needed to meet the specs of a CXL memory for high-performance computing applications.

The promise of OTS-only memories for next-gen compute system architectures

Superconducting technology will revolutionize AI and machine learning roadmap

Quentin Herr

Anna Herr

Sustainable hardware through the co-optimization of system and NbTiN-based superconducting technology: first milestones

The expected growth in electrical power needed for cloud-based computing puts severe pressure on the environment, cost, and available computing resources.

Superconducting digital technologies can help fill the needs, promising 100x more energy efficiency and 1000x more compute density than classical CMOS.

This article sheds light on how this technology can advance artificial intelligence (AI) and machine learning (ML). The authors highlight the importance of system-level co-development, explain the physics behind the technology, and present a superconducting technology scaling roadmap.

Superconducting digital technology to revolutionize the AI and machine learning roadmap

Imec and ASML open joint High NA EUV Lithography Lab

Marc Assink

Opening of the joint ASML-imec High NA EUV Lithography Lab marks a milestone in preparing High NA EUV lithography for accelerated adoption in mass manufacturing

Imec and ASML open joint High NA EUV Lithography Lab offering an early development platform to the leading-edge semiconductor ecosystem

Die-to-wafer hybrid bonding with Cu interconnect pad pitch of 2µm

Improved die-to-wafer assembly flow opens doors to logic/memory-on-logic stacking, and to optically interconnected systems-on-wafer

Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

We offer you both R&amp;D solutions to create new technologies as well as innovation services applicable to both products and services. Your project can be big 

Virtual Wall

CMOS 2.0: bringing heterogeneity inside the system-on-chip

Inside imec's N2 P-PDK workshop

Leap in Belgian quantum communication infrastructure: first QKD links

Advancing neurotech from brain surface to brain depths

Imec introduces best-in-class ADCs for base stations and smartphones

Imec demonstrates functional monolithic CFET devices with stacked bottom and top contacts

Meet imec fellow Joris Van Campenhout

Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter

Podcast: Deep-Tech disruption

The promise of OTS-only memories for next-gen compute system architectures

Superconducting technology will revolutionize AI and machine learning roadmap

Imec and ASML open joint High NA EUV Lithography Lab

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