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TSMC 2024 NA OIP Ecosystem Forum
September 25, 2024 | Santa Clara, USA
Open Innovation Platform Ecosystem Forum
Imec
Imec.IC-link, a complete ASIC (application-specific integrated circuit) solutions provider will be present in booth #420. As a TSMC VCA (Value Chain Aggregator) we can help you to realize your idea in silicon.
Event details
Annual TSMC's event where you can learn about:
- Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes
- Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
- Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
- Ecosystem-specific AI-assisted design flow implementations for 2D and 3DIC design productivity and optimization
- Successful, real-life applications of design technologies, IP solutions, and cloud-based designs from TSMC's Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market.