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/Semicon Taiwan 2024

Semicon Taiwan 2024

04 - 06 September 2024 | Taipei, Taiwan

Breaking Limits: Powering the AI Era

Imec

‘Scaled Silicon Photonics and 3-D Technologies for next-generation AI/HPC systems’ by Dr. Joris Van Campenhout, Senior R&D Director and Fellow, imec on September 3 in the Silicon Photonics Global Summit

‘Deep Pitch Scaling of wafer-to-wafer and die-to-wafer Cu/SiCN hybrid bonding’ by Dr. Eric Beyne, Sr. Fellow, VP R&D, Program Director 3D System Integration, imec on September 5 in the Heterogeneous Integration Global Summit 

‘Challenges in the land of Automotive High-Performance Computing: Chiplets to the Rescue’ by Bart Placklé, VP Automotive, imec on September 5 in the Global Auto Chips Executive Summit

‘The big bang of the digital age … the start of an undiscovered universe’ by Dr. Luc Van den hove, CEO & President, imec on September 5 in the CEO Summit.

About

The event features themed pavilions and innovation zones dedicated to green manufacturing, heterogeneous integration, materials, Taiwan localization, testing, and workforce development. New pavilions focusing on AI, smart mobility, silicon photonics, and precision machinery have also been introduced to align with evolving market trends and demands.

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