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/Optica Online Industry Meeting: PIC Packaging for Volume Production

Optica Online Industry Meeting: PIC Packaging for Volume Production

February 25, 2025 | Online

Industry leaders gather online to discuss PIC packaging for volume manufacturing.

imec

Leili Shiramin, Program Manager, will be a speaker and will cover the LNO & fiber assembly to silicon photonics PICs.

Event details

Industry meeting on Photonic Integrated Circuits (PICs) packaging for volume manufacturing. This event gathers industry leaders to discuss transformations in PIC packaging to meet mass manufacturing demands, similar to CMOS microelectronics. They will explore strategies for high throughput and yield, essential in today's tech landscape. 

The meeting will tackle challenges in PIC assembly, such as precision alignment, thermal management, and co-packaging with electronic components. They will also discuss the shift towards wafer-level processes required for increased production volumes, encouraging collaboration and innovative solutions for mainstream volume PIC manufacturing.

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