imec logo
Contact
CMOS: advanced and beyond
Discover why imec is the premier R&D center for advanced logic & memory devices.
Integrated photonics
Take a look at technologies for optical transceivers, sensors and more.
Health technologies
See how imec brings the power of chip technology to the world of healthcare.
Sensing and actuation
Explore imec’s CMOS- and photonics-based sensing and actuation systems.
Connectivity technology
Look into our reliable, high-performance, low-power network technologies.
More expertises
Discover all our expertises.
Research
Be the first to reap the benefits of imec’s research by joining one of our programs or starting an exclusive bilateral collaboration.
Foundry services
Build on our expertise for the design, prototyping and low-volume manufacturing of your innovative nanotech components and products.
Venturing and startups
Kick-start your business. Launch or expand your tech company by drawing on the funds and knowhow of imec’s ecosystem of tailored venturing support.
Education and workforce development
Imec supports formal and on-the-job training for a range of careers in semiconductors.
Solutions
Use one of imec’s mature technologies for groundbreaking applications across a multitude of industries such as healthcare, agriculture and Industry 4.0.
Semiconductor technology
Life sciences and health solutions
Data and telecommunication
Automotive technologies
Robotics technology for Industry 4.0
More applications
/Optica Online Industry Meeting: PIC Manufacturing, Packaging and Testing

Optica Online Industry Meeting: PIC Manufacturing, Packaging and Testing

27 - 27 August 2024 | Online

Focused on the dynamic world of Photonic Integrated Circuits (PICs) manufacturing, packaging, and testing.

imec

Philippe Soussan, Strategic Development Director will give a presentation

about

Join the online industry meeting focused on the dynamic world of Photonic Integrated Circuits (PICs) manufacturing, packaging, and testing. This event brings together industry leaders and innovators from across the PIC manufacturing ecosystem. We will delve into the significant transformations that packaging and testing of PICs have undergone to align with mass manufacturing demands, akin to the approaches seen in CMOS microelectronics. Emphasis will be on exploring strategies for achieving high throughput and yield, crucial in today's rapidly evolving technological landscape.

The meeting will address the unique challenges in PIC assembly, such as the need for precision alignment, effective thermal management, and the complex co-packaging of photonic circuits with electronic drivers and host chips. The intricacies of PIC testing, which involves both electrical and optical probing with exacting standards for parameter requirements and positional accuracy, will also be a key focus. We aim to discuss the shift towards wafer-level-capable processes necessitated by increasing production volumes, fostering opportunities for collaboration and innovative solutions to make volume PIC manufacturing mainstream.

Discover more