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/LE2AP+LEELIS 2024

LE2AP+LEELIS 2024

09 - 11 September 2024 | imec, Leuven

Low Energy Electron Lithography, Imaging, Soft Matter and Application in Patterning

About LE2AP+LEELIS

We welcome you to the joint conference on Low Energy Electron Applications in Patterning (LE2AP) + Low Energy Electron Lithography, Imaging and Soft Matter (LEELIS) to be held on 9th-11th September 2024 at imec (Leuven, Belgium). LE2AP+LEELIS is an initiative that aims to merge the communities of researches from initial Training Networks ELENA (https://elena.hi.is/) and SIMDALEE2 (https://cordis.europa.eu/ project/id/606988), both Marie Sklodowska - Curie EU-funded initiatives, and from the LEELIS conference series (held bi-yearly since 2015).

Scope

Fundamental research on the generation of low energy electrons and their interaction with molecules and thin films towards applications for patterning and imaging.

Specifically, the generation of low energy electrons induced in matter by electron beam, photon beam, ion beam or atom beam, the absorption/transmission through matter, the electron mean free path, the sample/photoresists/stack interactions and charging and damage mechanisms, related characterization techniques (photoemission, total electron yield, residual gas analysis, tomography, mass spectrometry, electron / infrared spectroscopy.

Patterning and imaging of materials both at small scale and at high volume manufacturing: focused e-beam induced processing (FEBIP), electron beam lithography (EBL), extreme ultraviolet lithography (EUVL), ion/atom beam lithography, X-ray lithography, low-energy electron microscopy (LEEM), low-voltage (scanning) electron microscopy.

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