ISSCC 2025

Imec

Imec is present at the 2025 IEEE International Solid-State Circuits Conference with booth number 8. Explore groundbreaking advancements in circuits and systems. We are proud to showcase our latest innovations across a wide range of cutting-edge technologies:

• Advanced RF Technologies and Circuits: GaN-on-Si solutions for Beyond-5G cellular and non-terrestrial networks (NTN).

• High-Efficiency, Low-Power Systems and Circuits: Innovations in data converters, neuromorphic edge computing, and Bluetooth/UWB connectivity.

• Biomedical Devices: Driving next-generation healthcare applications.

• Specialty Image Sensors and Sense & Actuate SoCs: Precision sensing and actuation for diverse applications.

• Heterogeneous Integration: Pioneering chiplets, 3D-SoC technology, and advanced modeling techniques.

• Access to Advanced PDKs: Enabling training and development for cutting-edge designs.

• Wireline Data Converters and DSP: Leveraging scaled CMOS for unparalleled performance.

• Broadband Front-End Circuits for Optical Transceivers: Enhancing speed and efficiency in optical communications.

• End-to-End ASIC Development: Seamless solutions through imec.IC-link.

Connect with our experts to explore how Imec’s pioneering technologies can advance your innovations. Let’s shape the future of circuits and systems together.

• Giuseppe Gramegna, program director will co host a forum on Sunday, February 16th, 8:00 AM on Wireless Communication Technology for Space Applications: From Satellite to Dish and Smartphones Organizers:
  This forum brings together leading researchers and industry experts to explore the cutting-edge developments in satellite communication systems. Speakers will engage in discussions on enabling technologies and the challenges associated with designing electronics for aerospace applications, with an emphasis on the emerging nonterrestrial mobile telecommunication systems. Presentations will highlight recent advancements in wireless transceivers employed in satellites, mobile devices, and ground stations. The selected topics will delve into the complete stack of innovations required for consumer, ground and satellite electronics, encompassing system-level challenges, computational architectures, transistor-level circuit implementations, and radiation-tolerant designs.
• Nicolas Pantano, Principle member of technical staf will present Sunday, February 16th, 3.25 PM on From Monolithic 2D to Heterogeneous Integration: An Advanced Packaging Technologies Landscape
• Peter Ossieur Senior Researcher and Program Manager will give a tutorial on Sunday, February 16th, 10:30 AM on Front-End Circuit Design for High-Speed Optical Transceivers 
  Optical transceivers form the backbone of our ICT infrastructure and are required to transport ever-growing capacities in ever-shrinking energy and density footprints. In this tutorial, CMOS and SiGe BiCMOS front-end circuits such as low-noise broadband transimpedance amplifiers, broadband drivers for modulators and lasers will be addressed, covering low-power lumped and traveling-wave implementations. Next, it will be shown how co-design of electronics and photonics can be used to optimize performance such as bandwidth, power consumption or area. Such codesign can extend beyond quantitative optimization to include shifting functionality between the optical and electronic domain.
• Sophie Beyne, R&D project lead is panelist on the panel on February 18th, 8:00 PM on Quantum Computing: Whose Qubit is Better? Quantum computing utilizes principles of quantum mechanics to solve intricate computational problems more efficiently than classical computers. Various qubit technologies are being developed for this purpose, such as superconducting qubits, trapped ions, and silicon-spin qubits. Each approach has its supporters and critics with prominent industry players investing heavily in one or more of these technologies. The race is on to determine which qubit technology will emerge as the dominant choice. Be prepared to participate in a discussion with our panel of experts as they weigh in on the advantages and challenges associated with each of the innovative approaches to determine whose qubit will rise to the top. 
• Giuseppe Gramegna, program director  will co-chair the session on Wednesday, February 19th, 10:05 AM on Wireless Transmitters and Front-Ends 
• Pol Van Dorpe, Fellow, will present on February 20th at 1:40 PM on Photonics Enhanced Imaging for Omics and Medical Imaging 

Booth

Imec will be represented at ISSCC in booth 8.

Event details

The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts…

Discover more