imec logo
Contact
CMOS: advanced and beyond
Discover why imec is the premier R&D center for advanced logic & memory devices.
Integrated photonics
Take a look at technologies for optical transceivers, sensors and more.
Health technologies
See how imec brings the power of chip technology to the world of healthcare.
Sensing and actuation
Explore imec’s CMOS- and photonics-based sensing and actuation systems.
Connectivity technology
Look into our reliable, high-performance, low-power network technologies.
More expertises
Discover all our expertises.
Research
Be the first to reap the benefits of imec’s research by joining one of our programs or starting an exclusive bilateral collaboration.
Foundry services
Build on our expertise for the design, prototyping and low-volume manufacturing of your innovative nanotech components and products.
Venturing and startups
Kick-start your business. Launch or expand your tech company by drawing on the funds and knowhow of imec’s ecosystem of tailored venturing support.
Education and workforce development
Imec supports formal and on-the-job training for a range of careers in semiconductors.
NanoIC pilot line
Aligned with the EU Chips Act, access to the pilot line will accelerate beyond-2nm innovation.
Semiconductor technology
Life sciences and health solutions
Data and telecommunication
Automotive technologies
Robotics technology for Industry 4.0
More applications
/IEEE ITherm 2025

IEEE ITherm 2025

May 27 - 30, 2025 | Dallas, USA

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

imec

 Georg Elsinger, Herman Oprins, Vladimir Cherman, Geert Van der Plas, Eric Beyne and Ingrid De Wolf from imec will present "Numerical Investigation of Surface Structures for Enhancement of Liquid Jet Impingement Cooling" on Wednesday May 28 at 8h45 AM.

Onur Yenigun, Vladimir Cherman, Herman Oprins, Geert Van der Plas and Eric Beyne from imec will take part in a presentation on "Thermal Interface Material Characterization Using Thermal Test Vehicle Assemblies With Bare Die and Lidded Packages" on Wednesday May 28 at 11h45 AM.

About

ITherm 2025 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2025 will be held along with the 75th Electronic Components and Technology Conference (ECTC 2025), a premier electronics packaging conference at the Gaylord Texan Resort & Convention Center in Dallas, Texas, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2025 will include panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition.

Discover More