IEEE Hybrid Bonding Symposium 2025
16 - 17 January 2025 | Silicon Valley, CA, USA
Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection.
imec
Invited talk on
Deep pitch scaling of wafer-to-wafer and die-to-wafer Cu/SiCN hybrid bonding by Anne Jourdain, imec - January 16 (09:30am)
About
Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.
HBS’25 is a hybrid event, with both in-person and virtual participation via WebEx.