Electronic Components and Technology Conference (ECTC) 2025
May 27 - 30, 2025 | Dallas, USA
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
imec
Imec will be present at the 75th ECTC with Special Sessions, Oral Sessions and Interactive Presentations on various topics, such as Packaging Technologies, Electrical Design and Analysis, Interconnections, Materials & Processing, and much more.
Overview of imec contributions
Tuesday May 27th
Anne Jourdain, R&D Manager on Deep Pitch Scaling of Wafer-to-Wafer and Die-to-Wafer Cu/SiCN Hybrid Bonding at imec, will take part in a panel on "Hybrid Bonding (HB): to B, or not to B? Needs and challenges for the next decade" from 8h30 to 10 AM.
Xiao Sun, a principal member of technical staff at imec, will take part in a panel on "Advancements in mmWave and Sub-THz Packaging for Communication and Radar Applications" from 3h30 to 5 PM.
Herman Oprins, a principal member of technical staff and R&D team leader at imec, will take part in a panel on "Thermal Management Solutions for Next-Generation Backside Power Delivery" from 3h30 to 5 PM.
Wednesday May 28th
Session Interactive Presentations 1
Oguzhan Orkut Okudur, Serena Iacovo, Shuo Kang, Deewaker Sharma, Mario Gonzalez, and Eric O.L. Beyne from imec will present "Mitigation of Wafer-to-Wafer Bonding Distortions Through Accelerated Simulations and Measurements" from 10 AM to 12 PM.
Session 01
Jaber Derakhshandeh, a principal member of technical staff at imec, will take part in a presentation on "Fluxless Thermocompression Bonding: Adapting to the Future" from 11h55 AM to 12h15 PM.
Session 05
Xiao Sun, Siddhartha Sinha, Hamideh Jafarpoorchekab, Melina Lofrano, Vladimir Cherman, Damien Leech, and Angel Uruena from imec will present "RF Si Interposer Platform for Advanced Chiplet-Based Heterogeneous Systems" from 11h55 AM to 12h15 PM.
Session 08
Ye Lin, Pieter Bex, Samuel Suhard, Boyao Zhang, Fulya Ulu Okudur, Amaia Diaz De Zerio, Naveen Reddy, and Efrain Altamirano Sanchez from imec will present "2 µm Pitch Direct Die-to-Wafer Hybrid Bonding Using Surface Protection During Wafer Thinning and Die Singluation" from 2 PM to 2h20 PM.
Session 09
Stefaan Van Huylenbroeck, Soon Aik Chew, Boyao Zhang, Emmanuel Chery, Joke de Messemaeker, Prafulla Gupta, Nicolas Jourdan, and Sven Dewilde from imec will present "Self-Formed Barrier Using Cu-Mn Alloy Seed Applied to a 400nm Pitch Wafer-to-Wafer Hybrid Bonding Technology" from 3h45 PM to 4h05 PM.
Thursday May 29th
Session 17
Xiao Sun, a principal member of technical staff at imec, will (co-)chair all the presentations within track 17 "Signal Integrity / Power Integrity for Advanced Packaging Technologies" from 9h30 AM to 12h35 PM.
Session Interactive Presentations 3
John Slabbekoorn, Steven Brems and Francois Chancerel from imec will take part in a presentation on "IR Laser Debonding for Silicon Based Temporary Carrier Systems Enabling 2.5D and 3D Chiplet Integration Processes" from 10 AM to 12 PM.
Sven Dewilde, Steven Deckers, Nancy Heylen and Harold Philipsen from imec will take part in a presentation on "Wet-Chemical Cu Cleaning for Fine-Pitch Hybrid Bonding" from 10 AM to 12 PM.
Aleksandar Radisic, Ehsan Shafahian, Zaid El-Mekki, Punith Kumar Mudiger Krishne Gowda, Jaber Derakhshandeh and Herbert Struyf from imec will take part in a presentation on "Development and Characterization of Electrodeposited Tin-Indium Alloy Microbumps for Low Temperature Assembly" from 10 AM to 12 PM.
Koen Werner J. Kennes, Pieter Bex, Ye Lin, Samuel Suhard, Dieter H. Cuypers, Alain Phommahaxay, Gerald Beyer and Eric O.L. Beyne from imec will present "Impact of Temporary Substrates and Adhesives on Die-to-Wafer Overlay" from 10 AM to 12 PM.
Session 14
Stefaan Van Huylenbroeck, Soon Aik Chew, Boyao Zhang, Lieve Bogaerts, Cindy Heyvaert, Serena Iacovo, Michele Stucchi, and Sven Dewilde from imec will present "Wafer-to-Wafer Hybrid Bonding Technology With 300nm Interconnect Pitch" from 11h35 AM to 11h55 AM.
Session 22
Sujan Kumar Sarkar, Andrea Mingardi, Rajendra Kumar Saroj, and Sandip Halder from imec will present "Optimization of Alignment Model and Metrology During Backside EUV Lithography Patterning for CFET Technology" from 2h20 PM to 2h40 PM.
Session 24
Abdellah Salahouelhadj, Kris Vanstreels, Joke de Messemaeker, Aleksandar Radisic, Zaid El-Mekki, and Carine Gerets from imec will present "Thermal-Mechanical Behavior of Highly (111)-Oriented Nano Twinned Electroplated Copper for Advanced Electronic Packaging" from 2h20 PM to 2h40 PM.
Kris Vanstreels, Oguzhan Orkut Okudur, Yusuf Ozdemir, Mario Gonzalez and Eric O.L. Beyne from imec will present "Nanoindentation Based Methodology to Characterize the Adhesion Strength of Dielectric Bond Interfaces" from 2h40 PM to 3 PM.
Session Interactive Presentations 4
Tiffany Tang, Dieter H. Cuypers, Aldrin Vaquilar, Pieter Bex, Koen Werner J. Kennes, Alain Phommahaxay and Eric O.L. Beyne from imec will present "Characteriation of FOWLP Process Using Temporary Bonding Material on Carrier With Very Low Die Shift" from 2h30 PM to 4h30 PM.
Shuo Kang, Serena Iacovo, Koen D'have, and Oguzhan Orkut Okudur from imec will take part in the presentation on "Wafer-to-Wafer Bonding With Saddle-Shaped Wafers" from 2h30 PM to 4h30 PM.
Session 20
Nelson Pinho, Lili Wang, Murat Pak, Punith Kumar Mudiger Krishne Gowda, Amaia Diaz De Zerio, Jeonho Kim, Andy Miller, and Eric O.L. Beyne from imec will present "Fine Pitch Semi-Additive RDL-Process Development" from 2h40 PM to 3 PM.
Session 19
Melina Lofrano, Herman Oprins, Geert Van der Plas and Eric O.L. Beyne from imec will present "Thermal Impact of BSPDN for 3D Memory and Logic Integration" from 4h05 PM to 4h25 PM.
Friday May 30th
Session Student Interactive Presentations
Jaber Derakhshandeh, Tom Cochet, Ehsan Shafahian, Prathamesh Dhakrasa, Eric O.L. Beyne and Ingrid De Wolf from imec will present "Intermetallic Compounds (IMC) Growth Investigation, Kinetic Parameter Analysis and Relibility Evaluation of Indium Solder Metal for 3D Integration Packaging" from 10 AM to 12 PM.
About
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.
The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.