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Imec Presents Together with Renesas Electronics an Ultra-Low Power Transceiver for Bluetooth 5 and Beyond with Lowest Supply Voltage Ever Reported

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PR InP Chiplet integration

Press

Seamless InP chiplet integration on 300mm RF Silicon interposer
PR ADC

Press

Imec introduces best-in-class ADCs for base stations and smartphones
PR D-Band Beamforming

Press

Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter
PR ADC

Press

Breakthrough ADC for very-high-speed wireline
PR aRF

Press

Imec demonstrates GaN-on-Si MISHEMTs with excellent performance for 5G-advanced base station and mobile device applications
article GaN & InP

Longread

Scaling up GaN- and InP-based technologies for 5G and 6G
Press release aRF

Press

Imec introduces simulation framework to better predict thermal transport in RF devices for 5G and 6G.
imec article Heterogeneous integration

Longread

Heterogeneous integration technologies to enable the next generation of wireless 6G
6G

Vision

To boost 6G energy efficiency, we need models that can handle its complexities
6G

Blog

To reap the rewards of 6G, we need to start sowing the seeds now
6G

Blog

It’s time to start imagining the kind of 6G we want
advanced RF imec

Research update

Imec researchers pioneer a compact 8-bit, 8GS/s time-interleaved SAR analog-to-digital converter, and a power-efficient 140GHz T/R front-end module

Published on:

12 February 2018

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