Automotive Chiplet Alliance Conference

On 20 and 21 March, representatives from all corners of the automotive ecosystem meet up for the third time to discuss how to jointly tackle the inevitable evolution towards chiplet architectures in cars.

This two-day event is organized by imec and hosted by Siemens. Participants will again come from OEMs, Tier 1s and Tier 2s, IDMs and foundries, IP and tool vendors, software companies, outsourced semiconductor assembly and test (OSAT) suppliers and design houses.

We sincerely hope you can join us and take part in the discussion.

Registration

Agenda

Wednesday 20th March

• 12.00: Arrivals/lunch provided
• 13.00: Welcome/expectation/agenda
  • Bart Placklé, Vice President Automotive at imec
  • David Fritz, Vice President of Hybrid-physical and Virtual Systems, Automotive and Mil-aero at Siemens
• 13.30: ACA update and mission
  • Bart Placklé, Vice President Automotive at imec
  • Kurt Herremans, Program Director Automotive at imec
• 14.00: Standardization WG reporting
  • Nicolai Behmann, Technical Solution Architect at Siemens and Holger Völkel, Head of Semiconductor Strategy at BMW
• 14.30: Keynotes

  • Automotive chiplets customer perspective - Why and What before How, David Fritz, Vice President of Hybrid-physical and Virtual Systems, Automotive and Mil-aero at Siemens 

  • Modular Testing of Chiplet-Based ICs with Standardized Design-for-Test - Po-Yao Chuang, Researcher at imec and Erik Jan Marinissen, Scientific Director at imec 

• 15.30: Coffee break
• 15.45: Keynotes
  • Advanced Packaging and Disaggregated Architectures for Automotive - Bassam Ziadeh, Global Technical Specialist – IC Packaging, Assembly & Test at General Motors
  • TSMC on Automotive, Chiplets and European Manufacturing - Marco Vrouwe, Senior Account Manager Emerging Business at TSMC
  • How to come to the first Chiplet based SoC generation - Michael Schaffert, Senior Vice President, Bosch
  • The Open Chiplet Economy is Coming to Automotive - Clifford Grossner, Chief Innovation Officer at OCP 
• 17.15: Fire side chat - moderated by Deanna Waun, Director Strategic Partnerships Automotive, imec​
  • Albert Heuberger, Executive Director of Fraunhofer Institute for Integrated Circuits IIS, Fraunhofer
  • Anthony Philippe, Research Engineer – System Architect, CEA List 
  • Michael Flynn, Professor, University of Michigan
  • Bart Placklé, Vice President Automotive at imec
• 18.00: End of day 1
• 19.00: Networking dinner

Thursday 21th March

• 08.15: Arrivals
• 08.30: Deep dive working sessions
  • Standardisation
  • Architecture/Acceleration to SOP
  • Manufacturing/supply chain
  • UCIE in Automotive (hosted by Ericles Rodrigues Sousa, Co-chair UCIE autoWG)
• 10.15: Coffee Break
• 10.30: Deep dive working sessions report out
• 11.30: Next conference location and date
• 11.45: Keynote
  • Common Chiplet Ecosystem between Automotive and HPC -  Philippe Notton, CEO and Founder, SiPearl
• 12.00: Closing keynote
  • Journey into the Future of Automotive Compute - Suraj Gajendra, Vice President, Automotive products and software solutions at ARM
• 12.25: Lunch/end of conference

Practicals

The Automotive Chiplet Alliance Conference is a live event, no virtual attendance will be accommodated. The conference will be hosted at Siemens, Munich Neuperlach.

A networking dinner will be hosted by Siemens on the evening of March 20, 2024. Capacity is limited, so please confirm your attendance via the registration form below.

Hotels in the vicinity of the conference venue:

• Mercure Perlach
• Ibis Styles Perlach

Parking

Please find information on how to reach the conference venue and parking access. Please note parking is limited.

Dinner

The dinner will take place at Knoedelalm

Registration is closed as the event is fully booked