International Microwave Symposium 2023

Event description

IMS is the flagship event in a week dedicated to all things microwaves and RF. The week also includes the IEEE MTT-S Radio Frequency Integrated Circuits Symposium (RFIC) and the Automatic Radio Frequency Techniques Group (ARFTG).

Imec at the 2023 International Microwave Symposium

Imec is present at the 2023 International Microwave Symposium with three papers, of which two first authored and two featured in the RFIC and IMS showcases. Next to these papers, imec is co-organizing a workshop with NXP and Samsung on Recent Advances in Ultra-Low-Power Wireless Communication Technology. Ilja Ocket program manager neuromorphic sensing will also give a workshop on 140GHz automotive radar. Patrick Reynaert (KU Leuven and imec) is panelist at the “RF/Microwave Packaging and Interconnect Technologies for Global Integration—Are We on the Right Track?” IMS panel session.

Highlight

Imec presents a low-loss, low-cost and mass-manufacturable printed circuit board (PCB) with embedded chip and waveguides, which paves the way for the development of compact, cost-effective, and high-performance 140GHz (automotive) radar and 6G mobile communications systems.

See paper: D-Band Air-Filled Substrate Integrated Waveguide (AFSIW) and Broadband Stripline to AFSIW Launcher Embedded in Multi-Layer PCBs, S. Sinha et al.

Overview imec contributions at IMW 2023

Sunday, June 11, 2023

Workshop

• WSA - Recent Advances in Ultra-Low-Power Wireless Communication Technology
  Organized by NXP, imec and Samsung 
  
  Abstract
  Ultra-Low-Power (ULP) wireless communication technology provides many unique features over conventional wireless communication such as high energy efficiency, low cost, small form factor, large scale deployments, reconfigurability and simple architecture  This workshop will bring together experts from academia and industry to highlight recent works and applications in this exciting technology  In the first topic, we are going to review the industry impacts on the most successful and large-scale commercialization using ULP wireless communication technologies such as RFID and Near-Field Communication (NFC)  After that, we are going to shift our focus to recent research advances in using RF backscattering techniques in Reconfigurable Intelligent Surface (RIS) and WLAN/BT connectivity solutions  In the last topic of this workshop, we will discuss recent advances from medical, industrial and academic fields in biomedical implants with technologies such as co-optimizing antenna and RFIC to miniaturize radio module volume  Unconventional wireless propagation methods are also introduced, such as body channel communication, Magnetoelectric, ultrasound, etc
• WSI - mm-Wave Integrated Radars: Opportunities and Challenges
  Organized by University of Minnesota and Uhnder, with a talk by Ilja Ocket, program manager neuromorphic sensing at imec
  • WSI-7 140GHz Automotive Radar — Sense and Nonsense, I. Ocket
    
    Abstract
    A new band for automotive radar exploiting higher frequencies is a natural evolution to further enhance radar performance. Increased resolution on all dimensions is the promise, the penalty to pay is maximum range. So what will be the role of 140GHz in next-generation automotive radar perception? This critically depends on technological progress, but even more so on the economics and on progress within the broader sensor fusion context. In this workshop presentation, we will give an overview on what we have learned from our 140GHz work so far on circuits, antennas and packaging and we will speculate on future developments in this field.

RFIC Reception and symposium showcase

• A D-Band 20.4dBm OP1dB Transformer-Based Power Amplifier with 23.6% PAE in a 250-nm InP HBT Technology, S. Gielen (KU Leuven) et al. (imec co-author)

Monday, June 12, 2023

IMS Industry showcase

• D-Band Air-Filled Substrate Integrated Waveguide (AFSIW) and Broadband Stripline to AFSIW Launcher Embedded in Multi-Layer PCBs, S. Sinha et al

Tuesday, June 13, 2023

IMS Technical sessions

• Mm-Wave GaN-on-Si HEMTs with a PSAT of 3.9W/mm at 28GHz, R.ElKashlan, et al.
• D-Band Air-Filled Substrate Integrated Waveguide (AFSIW) and Broadband Stripline to AFSIW Launcher Embedded in Multi-Layer PCBS, S. Sinha et al.

RFIC Technical Sessions

• A D-Band 20.4dBm OP1dB Transformer- Based Power Amplifier with 23.6% PAE in a 250-nm InP HBT Technology, S.Gielen (KU Leuven) et al. (imec co-author)

Wednesday, June 14, 2023

IMS Panel session

• RF/Microwave Packaging and Interconnect Technologies for Global Integration—Are We on the Right Track?
  With Patrick Reynaert (KU Leuven and imec)
  
  Abstract
  RF/microwave Front-End Modules (FEM) including antenna systems operating over MHz-through-THz frequency range for sub-7 GHz and 5G/6G applications, continuously require innovative solutions for meeting high electrical, RF, mechanical, and thermal perfor­mance at a low cost.This MTT-S Inter-Society Technology Panel (ISTP) will discuss recent advancements in RF/microwave packaging and interconnect technologies enabled by emerging new materials, advanced processing techniques and topological innovations as well as underlying technical challenges.This special panel will bring together industrial and academic experts of various background from different IEEE societies and other organizations, including IEEE MTT-S, EPS, AP-S, SSCS, EMC-S, CASS, and others.While the state-of-the-art achieve­ments in manufacturing, interconnect, and packaging techniques will be reviewed, this panel will debate the critical issues and the relative advantages and suitability of various emerging materials and interconnects (hybrid/metaconductors); processes such as additive and subtractive manufacturing; matured and emerging integration techniques - MCM, AiP/SoC/SiP/ SoS, heterogeneous and wafer-level packaging and chiplets; considering cost, performance, reliability/repeatability and volume production requirements; and will suggest possible application spaces with time scales and future directions.The panel will also discuss the impact of new technologies on the traditional realm of metal conductors and subtractive manufacturing.

Industry paper finalists

• D-Band Air-Filled Substrate Integrated Waveguide (AFSIW) and Broadband Stripline to AFSIW Launcher Embedded in Multi-Layer PCBS, S. Sinha et al.

View the full IMS 2023 program here.