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Press release
2 March 2026
New advanced interconnect PDKs pave the way for high‑density, energy‑efficient chip‑to‑chip integration.

Research update
DTCO study supported by experimental demonstration of hybrid channel orientations which are needed for A3

Technology review
Dimensional scaling, process simplification, and design flexibility – key drivers of High NA EUV lithography

Press release
25 February 2026

Press release
17 February 2026

Page-turner

Press release
12 February 2026

Press release
9 February 2026

Press release
3 February 2026

Press release
2 February 2026

Press release
27 January 2026
Explore the scientific achievements of imec’s researchers, including those at affiliated university research groups.

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